1.Switch 產品熱傳設計
2.與團隊(HW and ME)合作完成系統熱傳模擬及流場設計
3.風扇及導熱材料(heatsink and TIM)選用
4.與供應商合作完成散熱模組設計(氣冷及水冷架構)
5.Review 相關測試結果及優化 (thermal, air flow and acoustic test)
6.與客戶討論產品熱傳設計方向與solution
〝1.Thermal design and measurement of server, storage and edge server projects
2.Cross functional collaboration and communication
3.Supplier management of thermal parts
4.Advanced thermal solution study〝