面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 18天前更新
【本職缺接受台積電官方網站與1111投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4284&source=1111&tags=2024DomesticCampus_1111
Description:
1. Leading edge product development. Learn the most advanced technology semiconductor manufacturing, identify effective process solution for yield and chip performance improvement.
2. Involving cross-team work for joining developed project. Coordinate with customer / Fab / different support team closely to address improvement opportunities and work-out the solution.
3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue.
4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology.
Qualifications:
1. Master‘s degree or above in Electrical Engineering, Physics, Material and Photonics
2. Familiar with semiconductor devices / manufacturing, Electronics, and circuit design
3. Willing to learn new knowledge, good self-learning attitude, enjoy challenge
4. Good communication skills, be able to work with cross-functional teams & customers
5. Fluent in English
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