• 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4278&source=1111&tags=2024DomesticCampus_1111 Description: 1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore‘s Law and in post-Moore era. 2. Long prospective career path in semiconductor technologies looking at more Moore‘s and beyond Moore‘s Law Eco-industry. Job Description: 1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling. 2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking 3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect with focus on parallel processing and high-speed networking. Qualifications: 1. Solid skills build-up with hands-on operation. 2. Positions are reserved for those who have strong interest in emerging, exciting and disruptive technologies and for those who enjoys an intellectual-stimulating environment with work-life balance. Engineers and scientists from well-experienced to new in system integration and relevant fields are encouraged to apply. 3. Master’s degree or above in Science/Engineering related field with strong motivation to grow in new field 4. Senior position in system-level pathfinding, innovative heterogeneous system integration, and technology road-mapping 5. Project/team management experience for management position.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4279&source=1111&tags=2024DomesticCampus_1111 Description: 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. 我們確保晶片的品質、持續提升良率,提供給客戶具有競爭力且高品質的晶片,讓電子產品不但先進且效能穩定;製程整合工程師為半導體製造中的重要協調者,需要與客戶溝通了解客製化的晶片應用需求,再將訊息帶回廠內,與各工程單位合作。良率精進工程師監控晶片的良率與缺陷,使用量測機台監測晶片的缺陷,找出可能的問題,再與製程解決問題。 Qualifications: 1. Master‘s degree or above in engineering or scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 2. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics. 3. Exhibit good and open communication skills, be able to work within cross-functional teams, including internal and external partners. 4. Fluent in English. 5. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. 6. Flexibility in changing priorities and responsibilities to support business needs. 7. Hands-on participation and a strong sense of ownership. 8. Willingness to make frequent fab presence. 在這個領域發光發熱,要具備:半導體元件物理與電性知識、英文與溝通能力、領導與問題解決能力、程式語言作為良率改善工具。
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4280&source=1111&tags=2024DomesticCampus_1111 Description: 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. 我們在第一線負責晶片製造過程,改善機台製程參數的設定,提升良率並讓機台每單位時間產出增加,也降低生產成本;半導體製程可大致分為四大模組,大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 Qualifications: 1. Master‘s degree or above in Electrical Engineering, Physics, Materials science, Chemistry or Chemical Engineering. 2. Semiconductor internship experience is preferred. 3. Exhibit good and open communication skills, be able to work within cross-functional teams. 4. Fluent in English. 在這個領域發光發熱,要具備:材料、物理、化學、機械背景知識、團隊合作、邏輯思考、問題解決能力
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4281&source=1111&tags=2024DomesticCampus_1111 Description: 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment 2. Sustain and troubleshoot issues with high-tech equipment 3. Improve and enhance the efficiency and productivity of equipment 4. Plan and execute the analysis or defect detection projects 5. Communicate with cross-functional engineers or vendors 機台是工廠穩定運作的基礎,我們在生產線上,負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題;如此可減少機台當機的時間與提升機台可運轉的時間,進而降低生產成本並提升公司的獲利能力。 Qualifications: 1. Bachelor‘s degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields 2. No experience required. However, experience in equipment maintenance or improvement is a plus. 3. Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus 4. Good problem-solving skills, communication ability, team spirit, active learning attitude and is fluent in English 在這個領域發光發熱,要具備:電機、電子、機械與自動化工程等知識,還需要有良好的溝通能力、團隊合作精神、創新的問題解決能力
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4283&source=1111&tags=2024DomesticCampus_1111 Description: 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 3. Provide a stable facility system to meet wafer production requirements. 4. Construction management & project coordination. Qualifications: 1. Bachelor‘s degree or above in Engineering, Materials Science, Environmental Engineering or related fields. 2. Strong communication and problem-solving skill with logical thinking and enjoy supporting the production related activities. 3. Ability to work independently and as part of a team. 4. Good work ethic and integrity, constantly innovating in daily operations.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4284&source=1111&tags=2024DomesticCampus_1111 Description: 1. Leading edge product development. Learn the most advanced technology semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joining developed project. Coordinate with customer / Fab / different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Qualifications: 1. Master‘s degree or above in Electrical Engineering, Physics, Material and Photonics 2. Familiar with semiconductor devices / manufacturing, Electronics, and circuit design 3. Willing to learn new knowledge, good self-learning attitude, enjoy challenge 4. Good communication skills, be able to work with cross-functional teams & customers 5. Fluent in English
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  • 月薪50000元 台北市中山區 2年工作經驗 2天前更新
    工作內容: 1、規劃和執行專案,包含時程、資源、風險和品質管理。 2、協調專案團隊,確保專案目標和期望達成。 3、部門間或外部夥伴溝通協調 4、監測和報告專案進度和問題,並提出改善方案。 5、編撰及維持專案產出文件和資料。 6、客戶溝通協調及進度報告、問題處置等。 7、至承接之資訊建置或維護等專案不定期至客端進行專管事宜 具備知識或技能: 1、了解基本的專案管理知識和方法。 2、具備良好的溝通、協調、解決問題和領導能力。 3、具備IT系統整合知識和技能,如系統及網路或儲域及套裝軟體整合、資安機制、機房及弱電工程等等。 4、具備相關工作經驗或證照者佳。
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    產假全勤獎金年節獎金員工生日禮金年終獎金
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4213&source=1111&tags=2024DomesticCampus_1111 Description: 因為期待無限可能,所以選擇台積。 台積致力於營造具挑戰性、可以持續學習而又有樂趣的工作環境,提供同業平均水準以上的薪酬與福利。 加入台積,您將與世界一流的優秀夥伴共事,透過最先進的製程技術,成就改變世界的大事,所有突破與創新,都有一份我們的努力。 歡迎「志同道合」的你,透過〝線上應徵〝事先註冊履歷,符合資格者,將享有優先面試的機會唷! 如您對台積電校園徵才感興趣, 我們替各位準備了三場次線上說明會(3/22、3/29、4/2)。 報名連結:請點我 (採線上報名,報名成功後將由台積電招募團隊審核後由系統發送e-mail通知,可重複報名不同場次) 歡迎同學們報名參加,以掌握台積趨勢、組織概況與求職撇步! ▋歡迎志同道合的夥伴,一起加入台積 ▋世界上的每一個夢,都由我們來圓夢 TSMC offers a wide variety of fulfilling careers and opportunities across our organization in many different locations. By joining TSMC, you will work with the best team in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. If you are interested in joining TSMC, don’t miss our 〝TSMC Campus Recruitment Online Briefing Session〝, which will include the introduction of our company, industry trend, career opportunities, and life at TSMC. The sessions will be held on Mar 22, Mar 29, and Apr 2. Registration link: click here *TSMC Talent Acquisition Team will send a notification email to eligible applicants who have successfully registered to the event. 2024 TSMC 校園熱門職缺 Campus Recruitment Job : R&D (研究與發展組織專區) 1-1 【2024 Campus Recruitment】TSMC R&D Engineer 1-2 【2024 Campus Recruitment】TSMC DTP Engineer 1-3 【2024 Campus Recruitment】TSMC MtM RD Engineer 1-4 【2024 Campus Recruitment】TSMC IIP Engineer 1-5 【2024 Campus Recruitment】TSMC Pathfinding for System Integration Engineer Operations (營運組織專區) 2-1 【2024 Campus Recruitment】TSMC Process Integration Engineer 2-2 【2024 Campus Recruitment】TSMC Process Engineer 2-3 【2024 Campus Recruitment】TSMC Equipment Engineer 2-4 【2023 Campus Recruitment】TSMC Intelligent Manufacturing Engineer 2-5 【2024 Campus Recruitment】TSMC Facility Engineer 2-6 【2024 Campus Recruitment】TSMC Product Engineer 2-7 【2024 Campus Recruitment】TSMC Advanced Packaging & Testing Engineer 2-8 【2024 Campus Recruitment】TSMC Module Associate Engineer 2-9【2024 Campus Recruitment】TSMC Technician Strategy & Supporting (策略暨支援組織專區) 3-1 【2024 Campus Recruitment】TSMC IT Engineer 3-2 【2024 Campus Recruitment】TSMC Quality & Reliability Engineer 3-3 【2024 Campus Recruitment】TSMC Corporate Planning Organization 3-4 【2024 Campus Recruitment】TSMC Materials Management & Risk Management Engineer 3-5 【2024 Campus Recruitment】TSMC Human Resources Specialist 3-6 【2024 Campus Recruitment】TSMC Finance & Accounting Specialist Qualifications: 上述職缺歡迎2024年學碩博應屆畢業生或可於2024年底到職者,主修電機、電子、光電、電信、物理、材料、化學、化工、機械、資工、資管、工工、環工、財會、管理、人資、勞工關係、心理等相關科系者尤佳。 【履歷填寫重點提醒】 1. 投遞履歷,請務必優先填寫完成:「畢業學校、科系、畢業年份」,系統資料送出後,收到面試邀請前,內文可以持續更新 2. 務必詳細填寫履歷資料,包含學歷、專業關鍵字與自傳等資訊,若您非外籍人士,除專業關鍵字外,其他欄位請以全中文填寫。 3. 自傳與專業關鍵字欄位有字數限制 (1000字),請確認填寫字數,以免造成網頁無法成功送出。 4. 若履歷欄位型式為下拉式選單,請勿自行輸入資料,以免資料無法正確送出。 更多2024校園徵才招募活動資訊,請密切關注台積電FB粉絲專頁 @加入台積 共創奇蹟 【Notes】 1. Please prioritize completing the 〝Graduation School, major, and graduation year〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. For more information about the 2024 campus recruitment activities, please search TSMC FB fan page @加入台積 共創奇蹟
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  • 月薪28000~32000元 台北市中正區 工作經歷不拘 7天前更新
    ※本職務提供優質⼯作環境及完善職專業培訓機制,員⼯在職學習及升遷可獲得保障。 ▼⼯作內容: 1. 執⾏電腦軟硬體各項設備的安裝。 2. 找出並解決電腦故障原因。 3. 幫客⼾進⾏電腦升級分析,找出最適合的升級⽅案。 4. 進⾏電腦穩定度測試,減少客⼾當機的情況。 5. 委外駐點台北市國營企業資訊/維護服務。 –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ※歡迎對電腦資訊問題處理及學習有⾼度興趣者投遞。 ※具溝通能⼒及⼯作安排配合度佳者優先錄取。
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    產假產檢假年節獎金年終獎金禮品
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 4天前更新
    工作內容 深度學習模型、加速器軟硬體系統與應用開發 - 深度學習技術開發 - 深度學習加速器開發 - 嵌入式系統實現 - 系統整合測試 薪資待遇 - 面議 - 具相關經驗者,年薪可談,並有員工認股機會,績效獎金依公司營收表現或績效達標情形另計 人格特質 具團隊合作精神及協作能力 積極主動、工作態度嚴謹 充滿好奇心、樂於學習新技術 樂於學習與分享不同領域的知識 ※資料隨到隨審,合格者將通知面試,如資格不符,恕不另行通知。
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  • 時薪190元 台北市大安區 工作經歷不拘 1天前更新
    1. 協助ISO27001驗證專案進行,參與內控討論與記錄,協助繪製流程圖。 2. 協助資訊安全控制措施執行事項與後續改善追蹤。 3. 協助準備驗證相關文件製作。 4. 其他主管交辦事項。
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    員工生日禮金三節獎金員工團保員工購物優惠
  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 7年工作經驗 3天前更新
    1.大型資料庫系統管理 2.深度學習影像資料處理、擷取與資料分析 3.規劃影像資料收集方案 4.分析現有資料庫,尋找提升資料品質的解決方案 5.帶領Data team
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  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 8年工作經驗 3天前更新
    1.As an embedded software development leader, you will design, develop and optimize automotive product-relevant functions, based on OEM or Tier-1 customer demands. 2.Define architecture, design, and test strategies to ensure the best functional testing coverage during the development and production stage. 3.Develop automation frameworks using existing and new tools for software automation testing. 4.Use various facilitation techniques to enable collaborative problem-solving. ※依學經歷、工作年資敘薪
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  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 5年工作經驗 3天前更新
    1. 車電硬體系統整體規畫能力,熟悉ARM Base Processor /MCU 零件。 2. 熟悉線路繪製技巧,Layout相關設計規格,高速訊號量測能力,能夠指導與訓練下屬進行任務。 3. 能夠有能力協助屬下同仁的技術問題,協助及指引找出解決方向。且能適合分配團隊成員任務比重。 4. 能與客戶討論與制定硬體規格,確認合意的產品規格,具備對客戶簡報能力,含Proposal presentation, Issue report *** 依學、經歷敘薪 ****
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  • 隨薪所欲